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Legacy’s innovative product lines include both the original and new leadless versions of Canopy®. A chip-stacking alternative, Canopy® is Legacy’s patented, registered technology designed specifically to address the growing needs of large server environments and other arenas where limited space is prime consideration.

Canopy® is a 3-dimensional printed circuit board subassembly and process technology for high-speed, high-density SDRAM DIMMs for SDR, DDR 1 and DDR 2 memory applications, as well as other space-limited designs.


 
TSOP Canopy® Reliability Report BGA Canopy® Reliability Report Canopy® Technology Presentation
Datasheets Available upon Request Thermal Matching Summary for Planar BGA and BGA Canopy®



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